QUALITY BY DESIGN
CORE MODULES
Ready-To-Use Modular Building Blocks for Embedded Products - to facilitate time and cost effective design & development of State of the Art professional Embedded products.
This includes:
Modular Hardware (PCB Assembly) along with a suitable SDK for quickly building proof of concept / performance validation prototypes as well as field-deployable products. Customization:
DCT also offers engineering service to customize these modules as required for specific applications as well as design and development of interface boards, SW stacks and embedded application SW for specific applications.
Modular Hardware (PCB Assembly) along with a suitable SDK for quickly building proof of concept / performance validation prototypes as well as field-deployable products. Customization:
DCT also offers engineering service to customize these modules as required for specific applications as well as design and development of interface boards, SW stacks and embedded application SW for specific applications.
TRIMER™ - THERMAL IMAGING CORE
TRIMER™ is a customizable off the shelf Thermal Imaging Core with built-in ISP
KEY BENEFITS AND FEATURES
- Thermal camera module for wide range of application.
- Built-in ISP with Bad-pixel correction,NUC,Tone-mapping,DDE,CLAHE etc.
- Image parameters configurable over serial interface.
- Customizable mechanical and interface connectors.
- Vibration and shock tested as per MIL STD 810G.
- Operating Temparature : -40°C to 60°C.
Available Models
L4A_ZDN : (1280 x 1024-12μm)
L6D_ZDM : (640 x 480 - 12 μm)
L3T_LUL : (320 x 240-12μm)
L6P_ZDM : (640 x 480 - 17 μm)
L3P_ZDM : (320 x 240 - 17 μm)
SoM - SYSTEM on MODULE
Processing sub-system on a modular PCB with Application Processor SoC, DRAM, Flash memory and basic connectivity on-board with Linux SDK. All other interfaces from SoC are terminated on a pair of B2B connectors.
Suitable carrier boards can be developed to quickly build product prototypes or even deployable products based on form factor constraints. Carrier boards with commonly used peripheral interfaces on standard connectors are also available for a quick start to product development.
KEY BENEFITS AND FEATURES
- Embedded SW
- Linux / RTOS Ported with peripheral drivers integrated
- SDK Ready to start application development
- Optional Bare metal solution as required
- Suitable to use as Development / PoC platform & as Module in Product
- Use with Carrier board for Development / PoC
- Design Custom “carrier” board for product form factor/ peripherals
- All processing resources on SoM (DDR/ Flash/ Connectivity)
- Cost effective solution
- Low Power Consumption
- Support available for Custom HW / RTL/ Embedded SW design and development
Available Models
PF254 : RISC V SoC FPGA SoM
ZUSM : Xilinx ZynQ ultraScale SoM
Carrier Board: CMCGA1_G1F1_XX
SoM mounted on Carrier Board